| PART |
Description |
Maker |
| 2-1445094-2 2-1445094-3 2-1445094-6 2-1445094-4 2- |
VERTICAL THRU HOLE HEADER ASSY, 0.76 MIC GOLD CONTACTS, W/THRU HOLE HOLDDOWNS, SGL ROW. MICRO MATE-N-LOK?/a>
|
Tyco Electronics
|
| 5103308-3 5103308-6 5103308-2 5103308-1 5103308-7 |
HEADER ASSY, VERTICAL, LOW PROFILE, AMP-LATCH
|
Tyco Electronics
|
| MMB1901R480 MM-B1901-R480 36512-0196 0365120196 |
2.54mm (.100) Pitch DIN 41612 Header, Vertical, Through Hole, 0.4μm (16μ) Selective Gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, Through Hole, 0.4渭m (16渭") Selective Gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, Through Hole, 0.4楼矛m (16楼矛") Selective Gold (Au), 48 Circuits
|
Molex Electronics Ltd.
|
| 6-104362-0 5-104362-4 5-104362-6 5-104362-8 5-1043 |
HEADER ASSY, AMPMODU MTE, VERTICAL SINGLE ROW, .100 C/L, .025 SQ POST POLARIZED, WITH LATCHING & HOLD DOWN
HEADER ASSY, AMPMODU MTE, VERTICAL SINGLE ROW, .100 C/L, .025 SQ POST POLARIZED, WITH LATCHING & HOLD DOWN
|
Tyco Electronics
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 2-1445053-2 2-1445053-9 |
VERTICAL SURFACE MOUNT HEADER ASSY TIN CONTACTS, SURF MOUNT HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
VERTICAL SURFACE MOUNT HEADER ASSY, TIN CONTACTS, SURF MOUNT HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
|
Tyco Electronics
|
| 87891-0408 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 36511-0122 0365110122 MMB1502R963 MM-B1502-R963 |
2.54mm (.100) Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60μm (24μ) Gold (Au) Plating, Tail Length 4.50mm (.177), 64 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60渭m (24渭") Gold (Au) Plating, Tail Length 4.50mm (.177"), 64 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60楼矛m (24楼矛") Gold (Au) Plating, Tail Length 4.50mm (.177"), 64 Circuits
|
Molex Electronics Ltd.
|
| 15-80-0109 0015800109 70567-0275 A-70567-0275 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0105 0015800105 A-70567-0139 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 0877730005 87773-0005 |
3-Pin Header, Staggered, Vertical, Through Hole, Lead-free
|
Molex Electronics Ltd.
|
|
